IT'S A LAMINATE WORLD AFTER ALL
The vast majority of mixed signal ICs are packaged using multi-layer laminates. Years of research has gone into the process technology behind MLO to insure that it can be produced on the same lines and with the same tools as conventional laminate substrates.
DESIGNED FOR MANUFACTURABILITY
High performance embedded passive components require that key process parameters be held to very tight tolerances. By integrating process control monitors into each MLO strip, key parameters such as line width and dielectric thickness can be probed during the fabrication process.
REPEATABLE, PREDICTABLE RF PERFORMANCE
Through our proprietary tools and design flow, JMD's engineers use actual process data to design high yield and accurate RF component structures. A predictable process gives the designers the confidence to embed complex structures in the simulation phase and rely on the manufacturer's ability to control key process parameters and produce high yielding designs.
