By embedding passives components into a module substrate MLO provides significant advantages to designers of RF modules
SMALLER SIZE
MLO modules are smaller than modules made with conventional laminate substrates and surface mounted passive components. Smaller size means more room on the PWB for other components and room for additional wireless interfaces. Smaller size also means more applications for wireless RF ICs as opportunities for small form-factor portable and handled wireless products continues to grow.
LOWER COST
The need for filters, couplers, diplexers and baluns is not going away - in fact the number of passive components needed for advanced wireless standards is increasing due to the move to MIMO and OFDM. Placing critical passive components into the copper layers of a MLO substrate IS the lowest cost alternative compared to integration on Si, GaAs or discrete ceramic components. MLO can achieve the same level of passive integration in 6 layers of inexpensive plastic that requires over 12 layers of expensive LTCC.
DESIGN FLEXIBILITY
IC design spins can eat up valuable time to introduce a new product. Complex RF filters on GaAs or Si not only take up valuable space but also require a complete IC design cycle to change. A MLO package with embedded passives can be modified in much less time and for much less cost. By moving frequency dependent passive components from the die to the package the life and applications for RFICs can be extended by only changing the package to support new frequencies.
RF PERFORMANCE
Low loss passive components are critical for high performance RF applications. JMD's versatile MLO process enables the designers to manufacture unique filter structures that can not be realized in other technologies. The etching process leaves smooth conductors on the inner layers which reduce skin effect losses at high frequencies. The end result is filter structures with minimal loss in the pass band and steep out of band rejection.
