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JMD's Multi-Layer Organic (MLO) technology creates very compact, reliable modules with low-loss embedded passive components. MLO uses dielectric layers composed of advanced RF polymers like liquid crystalline polymer (LCP) and polytetrafluoroethylene (PTFE). By using thin dielectric layers (as small as 25 microns) and using a patented process to laminate them with other materials, MLO can be used for a wide variety of IC packaging applications.
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The dielectric layers of a MLO module contain compact, high performance passive components such as filters, couplers, diplexers, and baluns that are printed into copper layers using precision, laser direct imaging. These components are isolated and shielded from ground effects by suspending them between other layers of copper clad laminates.
All materials used in a MLO module are designed for high RF performance and reliability to insure that finished products will meet all relevant JEDEC specifications. Unlike standard laminate and ceramic packaging materials, MLO's dielectric layers have very low loss and can be produced in large, very thin sheets. The materials in MLO modules have CTEs similar to those of standard PWB materials to insure highly reliable interconnects even under severe thermal cycle conditions.
*screen printed conductors
