JMD Expands Product Offering
February 26, 2008 - < BACK
Atlanta, GA, February 26, 2008 - Jacket Micro Devices Inc. (JMD) announced the addition of highly integrated substrate packages for wireless applications to its product portfolio. JMD’s Multi-Layer Organic (MLO) technology is ideal for front-end modules (FEMs) and emerging embedded applications combining baseband, transceiver and RF front-end in a single package.
JMD's patented MLO SiP technology is the answer to the wireless industry's search for a cost effective high performance alternative to ceramic packages. As part of its new offering, JMD will supply high volume SiP substrates and design services utilizing its extensive RF component library.
“Many portable wireless applications require the next level of integration beyond just the front-end” said Jim Stratigos, CEO of JMD. “With the growing number of wireless SoC products that integrate baseband and transceiver functions on a single die, the next logical step is to integrate the entire wireless reference design into a single component. By embedding filter and matching components into the package, embedded modules made with MLO can be cost effective even for complex, multi-band applications.”
About Jacket Micro Devices (JMD)
JMD is the leading supplier of organic packages with embedded passive components. JMD’s patented Multi-Layer Organic (MLO) technology defines a revolutionary, system-in-package (SiP) approach to RF modules for wireless products and is ideal for RFIC and PA suppliers who need to design compact wireless products. JMD’s products can be rapidly customized and have higher levels of integration, resulting in fewer external components and faster time to market. For more information, visit www.jacketmicro.com or call +1 (404) 961-7240.
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