JMD Develops Halogen-Free Packaging Process
Green IC Packages with High RF Performance
June 13, 2008 - < BACK
Atlanta, GA, June 13, 2008 - Jacket Micro Devices Inc. (JMD) announced today that it has developed a halogen-free version of its patented Multi-Layer Organic (MLO™) packaging process.
MLO is the first commercial organic packaging technology to provide high Q RF filters embedded into the layers of a LGA package. MLO utilizes advanced, low-loss polymers and novel component geometries for System-in-Package (SiP) and Front-End-Module (FEM) applications where small size and low RF losses are critical. JMD’s first process, MLO 1.0, was already compliant with RoHS standards and JMD’s new process (MLO 2.0) is both RoHS compliant and halogen-free.
“Developing a halogen-free version of MLO required careful selection of materials and processes to insure that we did not compromise RF performance or reliability”, noted George White, JMD’s founder and CTO. “The materials we selected use non halogenated flame retardants which minimize the impact on moisture absorption, peel strength and dielectric constant.”
Prototype quantities of halogen-free MLO 2.0 will be available in the third quarter of 2008 with full production qualification by Q1 of 2009. JMD will be showcasing applications for MLO at the 2008 IEEE International Microwave Symposium in booth #2002.
About JMD
JMD is the leading supplier of organic IC packages with embedded passive components. JMD’s patented Multi-Layer Organic (MLO™) technology defines a revolutionary approach to wireless System-in-Package (SiP) designs for a wide variety of applications including wireless modules and other products where small size and high RF performance are critical. JMD provides custom SiP design services and production substrates from qualified high volume suppliers. For more information, visit www.jacketmicro.com or call +1 (404) 961-7240.
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