We look forward to seeing you at the following industry events

IEEE MTT-S International Microwave Symposium
June 15 - 20, 2008
Atlanta, GA
http://www.ims.2008.org

3D/SiP Advanced Packaging Symposium

April 29-30, 2008

Durham, NC

Dr. George White will present "A Novel Methodology for 3D Integration Using Multi-Layer Organics" at 3:30PM on Wednesday, April 30

ECTC

May 27-30, 2008

Lake Buena Vista, FL

Dr. George White will present "A Novel Methodology for 3D Integration Using Multi-Layer Organics" at 11:15AM on May 28