Simplify your wireless designs with Multi-Layer Organic (MLO™) technology. By embedding low-loss passive components into the layers of a printed circuit board or module substrate you can shrink your wireless products and reduce costs without compromising performance.

JMD's patented SiP technology is the answer to the wireless industry's search for a cost effective high performance alternative to ceramic substrates. JMD provides modules, design services, and high volume substrates for complex, highly integrated wireless products.  Click here to view a PDF version of our company brief.