April 2004 - JMD is formed and obtains exclusive license to key patents on multilayer organic packaging from the Georgia Institute of Technology

July 2004 - JMD receives seed financing from Noro Moseley Partners, Sevin Rosen Funds and Atlanta Technology Angels

June 2005 - JMD's founders receive U.S. patent 6,900,708 for "Integrated Passive Devices Fabricated Utilizing Multi-Layer Organic Laminates"

September 2006 - George White, JMD's founder and CTO, receives the AeA Spirit of Endeavor Award for Technology Innovation

October 2006 - JMD introduces world's smallest front end module for 802.11n

April 2007 - JMD introduces the first front end module for WiMax (802.16e)

August 2007 - JMD receives two European and one U.S. patent for key innovations in embedded passive technology

September 2007 - Singapore-based MicroCircuit Technology (S) Pte. Ltd. (MCT) begins volume production of MLO substrates for advanced wireless modules