The Packaging Research Center(PRC) at the Georgia Institute of Technology is a global Engineering Research
Center pioneering "Systems-On-A-Package"
(SOP) Research, Education and Industry Collaboration. The PRC funded by the National Science Foundation,
the State of Georgia, in partnership with the electronics industry.
Rogers Corporation is a manufacturer of high-performance specialty material products, serving
a diverse range of markets that includes portable communication devices, communication infrastructure,
consumer products, computer and office equipment, ground transportation and aerospace and defense.
Microcircuit Technology is a pioneer in advanced interconnects substrate manufacturing in S-E
Asia region - Singapore & Malacca. MicroCircuit provides quick-turn solution for semiconductor
substrates and high-end Chip-on-Board (COB) board, from package design to completion of substrate
fabrication.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry,
and offers one of the widest range of package & test portfolios in the world. Founded in 1972,
Carsem is among the most experienced companies in our industry and is recognized as one of the
largest in unit volume production.
Sanmina-SCI Corporation is a leading electronics contract manufacturer serving the fastest-growing
segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology
leader, Sanmina-SCI provides end-to-end manufacturing solutions, delivering unsurpassed quality
and support to OEMs primarily in the communications, defense and aerospace, industrial and medical
instrumentation, multimedia, computer and server, and automotive technology sectors.
