Jim Stratigos—Chief Executive Officer
Dr. George White—Chief Technology Officer and Co-Founder
Bob Bayruns—Vice President Engineering
Chris Conlin—Vice President of Marketing & Sales
Dr. Sid Dalmia—Director of Engineering and Co-Founder
Dr. Madhavan Swaminathan—Chief Scientist and Co-Founder
Rick Clancy—Director of Operations
Jim Stratigos —Chief Executive Officer
Jim
is a successful high-technology entrepreneur with executive and CEO experience in
a number of startups over the past 20 years. He was founder and CEO of Media4, Inc.,
where he pioneered the technology to distribute Internet content over direct broadcast
satellite networks. EchoStar acquired Media4 in 1999. Jim was also a co-founder at
Tridom Corporation. Involved in wireless communications management, engineering
and marketing for over 30 years, Jim has held senior positions at Scientific-Atlanta, Georgia
Tech Research Institute and Motorola, and is a founding member of Atlanta Technology Angels.
Jim holds BSEE and MSEE degrees from Georgia Institute of Technology.
Dr. George White—Chief Technology Officer and
Co-Founder
George
has over 17 years of experience in electronic packaging design and research; previously,
he worked at Georgia tech, Motorola and IBM. George was a member of the faculty
at the Georgia Institute of Technology where he lead the System on Package (SOP)
thin film electronic package development at Tech's Packaging Research Center. At
Motorola, he led the embedded passive program for organic PWBs. Technology developed
through this effort will be implemented in Motorola's next generation of mobile handsets.
He also led IBM's thin film conformal via MCM-D process development that is currently being used
for IBM's high-performance computers. George holds over 14 patents in electronic
packaging and is the author of numerous publications in electronic packaging technology.
Bob Bayruns—Vice President Engineering
Bob
has over 25 years of experience in RF semiconductor components and systems development.
In his most recent position, he served as VP of Engineering and Product Development
at WJ Communications. He has also held VP Engineering positions at Mobilian and Tropian,
along with executive level positions at ANADIGICS, including VP Business and Advanced
Development. Bob helped start ANADIGICS from its beginning where, during his fifteen
year career, he lead the company's efforts in the development of key RF technologies
for the wireless, fiber optics and CATV industries. His team developed the 1st plastic
packaged MMIC cell phone power amplifier to go into mass production in a wireless
cell phone handset. He was involved with the IEDM, MTTS and ISSCC where he served on the technical
program committee for over ten years. With 10 patents in circuit design and 20 published technical
papers, Bob received his BS degree in 1979 from Spring Garden College and his MSEE degree from
Rutgers in 1983.
Chris Conlin—Vice President of Marketing & Sales
Chris
has 25+ years experience in Marketing, Sales and General Management with electronic component
and semiconductor companies. Prior to joining JMD, Chris held the position of VP Marketing & Sales
at Alpha Industries (now Skyworks Solutions, Inc). While at Alpha, Chris lead the company's expansion
in commercial wireless applications, established a key account management system, restructured
the sales and service organizations, opened an Asia/Pac sales office and established new international
distribution channels. Prior to Alpha, Chris spent 16 years with Murata Electronics North America.
At Murata he held positions of VP Marketing, VP and GM, Georgia Operations and Group Product
Manager. As VP and GM Georgia Operations, Chris gained operational experience consolidating manufacturing
operations, divesting non-core product lines and streamlining product flow from multinational
plant locations. Chris has an MBA from Emory University and a BS in engineering from Farleigh
Dickenson University.
Dr. Sidharth Dalmia—Director of Engineering and Co-Founder
Co-founder
of JMD in 2002, Sid currently serves as the Director of Engineering and has co-authored more
than 50 IEEE and IMAPS journal and conference papers. Sidharth holds 3 US patents, 1 international
patent and has more than 10 US/international patents pending. Sidharth's recent works have won
him best IEEE Transactions and IEEE Conference paper awards from the IEEE CPMT society. His
doctoral thesis was nominated for the Georgia Tech outstanding thesis of the year award. He
has been invited as a speaker at several IEEE workshops and has served as a reviewer from IEEE
Transactions on Advanced Packaging. Sidharth received his B.S, M.S. and Ph.D. in Electrical
and Computer Engineering from Georgia Tech in 1998, 1999 and 2002 respectively.
Dr. Madhavan Swaminathan—Chief Scientist and Co-Founder
Madhavan
is co-founder of JMD, where he serves as the Chief Scientist. Prior to joining Georgia Tech,
he was with the Advanced Packaging Laboratory at IBM working on packaging for super computers.
He has 250+ publications in journals and conferences, has co-authored 3 book chapters, has 11
issued patents and has 6 patents pending. Madhavan has founded, served and supported several
IEEE committees and workshops, including the Topical Meeting on Electrical Performance of Electronic
Packaging (EPEP), the IMAPS Next Generation IC and Package Design Workshop, the Technical Committee
on Electrical Design, Modeling and Simulation, Future Directions in IC and Package Design, IMAPS
Next Generation IC and Package Design and the Future Directions in IC and Package Design.
Rick Clancy—Director of Operations
Rick
brings to JMD over 14 years of manufacturing engineering and supply chain management. He has
held manufacturing engineering positions at Ford Motor Company, Honeywell/Allied Signal, STATS
and most recently at Conexant Systems, responsible for Quality, Failure Analysis, Reliability,
Process Development, and Operations. At Conexant, Rick managed Business Systems development
for outsourced Operations, aiding Conexant's transition from predominantly internal factory
manufacturing to entirely fab-less contract manufacturing. Rick also was responsible for IC
packaging and assembly for its $600 million a year business divisions, including recommendations
for new products, technology development, strategy, managing overseas assembly contractors and
successfully reducing costs. Rick received his BS and MS in Ceramic Engineering from Georgia
Institute of Technology.
