WHAT WE ARE ABOUT
JMD is an ISO-certified supplier of services and solutions for wireless modules. JMD has developed a new patented platform technology that dramatically reduces the size and cost of the radio frequency (RF) components used in wireless devices, enabling for the first time the integration of all RF active and passive components into laminate modules.
HOW WE GOT STARTED
JMD was founded in 2004 by researchers at the Georgia Institute of Technology, who became aware of the unique capabilities of a new class of organic polymers for electronic packaging. In partnership with the Microelectronics Packaging Research Center at Georgia Tech, our founders recognized that by combining semiconductor process technology with low-loss organic polymers, dramatic reductions in the cost and size of RF packages could be achieved. JMD is the first company to exploit organic polymers in RF applications and challenge existing laminate, silicon and ceramic packaging technologies. Our patented technologies (known as MLO or Multi-Layer Organic) are at the core of JMD's value and are capable of shrinking the size of complex, high-performance wireless products by up to 90% relative to discrete designs.
THE JMD VISION
The intense demand for low cost, high performance consumer electronics can not be solved by relying solely on Moore's Law to double the density of integrated circuits (ICs) on average every 24 months. As a result, computers, cell phones, portable media players and TVs will, for the foreseeable future, require dozens of ICs to function. Conventional printed circuit board assembly, where individually packaged integrated circuits are attached along with discrete surface mount components, will not be able to meet the cost and size reductions needs of new electronic products. The semiconductor industry is investing billions of dollars in new packaging technologies with the goal to cram as many ICs as possible into even more tiny packages. The most promising solution is a System-in-Package or "SiP" where multiple ICs and passive components are combined into a single package or module. The most pressing need for new SiP solutions is in wireless products where multiple IC technologies along with RF passive components must be packaged closely together without impacting the quality of the wireless signals. None of the currently available solutions for wireless SiP have the component density or cost effectiveness required for the coming generation of products with multiple wireless standards. To meet the demands of wireless SiP, JMD has developed a new, patented platform technology known as Multi-Layer Organic (MLO) that allows wireless ICs to be packaged close to one another and on top of passive components.
