Simplify your wireless designs with Multi-Layer Organic (MLO™) packaging. By embedding low-loss passive organic components into module substrates you can shrink your wireless products and reduce costs without compromising performance.

JMD's patented SiP technology is the answer to the wireless industry's search for a cost effective high performance alternative to ceramic packages. JMD provides modules, package design services, and high volume substrates for complex, highly integrated wireless products.